IMPACT CONF.

國際電子零組件、組裝、封測、電路板產業的年度盛會第11屆國際構裝暨電路板研討會(簡稱IMPACT)， IMPAT-EMAP 2014大會係由IEEE CPMT-Taipei、IMAPS-Taiwan、工研院及台灣電路板協會共同主辦，獲國際學會IEEE和iMAPS認可，可謂是精華版的台灣ECTC，研討會主題「IMPACT for the next big things」， 今期待在消費性電子、雲端及行動通訊、醫療及汽車應用各方面的材料、製程、設計等研發，注入科技活水、開闢新商機、鏈結海內外之產學研三方合作橋梁! International electronic components, annual event assembly, packaging and testing, circuit board industry 11th International Seminar-Package-cum-board (referred to IMPACT), IMPAT-EMAP 2014 by the Department of General Assembly IEEE CPMT-Taipei, IMAPS-Taiwan, the industrial research homes and Taiwan Printed circuit Association co-sponsored by the international Society of IEEE and iMAPS recognition, can be described as the best version of Taiwan ECTC, theme of the seminar "IMPACT for the next big things", now look at consumer electronics, mobile communications and the cloud, medical and automotive applications in all aspects of materials, process, design and other research and development, science and technology into running water, open up new business opportunities, research tripartite cooperation at home and abroad of a bridge link!